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Technology / Passive fire protection / Electronics manufacturing / Quad-flat no-leads package / Semiconductors / Surface-mount technology / Semiconductor packages / Thermal resistance / Small-outline integrated circuit / Electronic engineering / Electronics / Electronic design


AN2388, Heatsink Smal Outline Package (HSOP)
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Document Date: 2013-01-28 12:39:58

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City

Denver / /

Company

Should Buyer / Freescale Semiconductor Inc. / Motorola / Freescale Semiconductor Hong Kong Ltd. / Freescale Semiconductor Japan Ltd. / Freescale Halbleiter Deutschland GmbH / /

Continent

Asia / Europe / Africa / /

Country

Japan / United States / /

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/

IndustryTerm

user-specific solutions / software implementers / All other product / metal housing / /

Organization

Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages / Printed Circuit Board / SEMI / /

Person

Tai Po / /

/

Position

Product Package Engineer / reasonable attorney / /

ProgrammingLanguage

R / /

ProvinceOrState

Colorado / /

Region

Middle East / /

Technology

radiation / Laser / Integrated Circuits / Integrated Circuit / /

URL

www.freescale.com / /

SocialTag