First Page | Meta Content | |
---|---|---|
![]() | Document Date: 2010-12-06 14:28:22Open Document File Size: 287,33 KBShare Result on FacebookCityRichmond / /CompanyIntertek Testing Services / Hewlett-Packard / NEC / Belden / Underwriters Laboratories / Agilent / Tektronix / /FacilityMarquette University / /IndustryTermvideo applications / cable applications / steel conductors / antenna applications / temperature range applications / electrical energy / higher frequency applications / copper clad steel / will document in their product / project management / copper covered steel / quality cable manufacturing techniques / /OrganizationFederal Communications Commission / Marquette University / Milwaukee / /PersonBeth / Martin J. Van Der Burgt / Martin J. Van Der Burgt Marty / Marty Van Der Burgt Page / /PositionSenior Product Engineering Project Manager / Vp / *Vp / center conductor / conductor / TDR/sampling head / center conductor and the outer conductor / corrugated copper outer conductor / Senior Product Engineering Project Manager for Electronics Division / /ProductPackard 4194A Impedance/Gain-Phase / LG 200C Cellular Phone / Packard 8751A / /ProvinceOrStateWisconsin / Prince Edward Island / /PublishedMediumthe January 2001 SMPTE Journal / /TechnologyBroadband / coaxial cable / dielectric / microwave / digital video / Cable TV / CMP / /SocialTag |