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Technology / Three-dimensional integrated circuit / Wafer / Applied Materials / SUSS MicroTec / Metrology / 3DS / Through-silicon via / Semiconductor device fabrication / Microtechnology / Electronics


SEMI® International Standards Information on 3DS-IC Activities January 2014 SEMI 3DS-IC Standards Activities
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Document Date: 2014-02-04 09:46:57

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Company

King Yuan Electronics / Altera / Applied Materials / Entegris / Koma Consulting / SUMCO / Rohm / Qualcomm / Intel / Xilinx / /

Country

Taiwan / /

IndustryTerm

manufacturing services / metrology equipment / manufacturing cost / manufacturing efficiency / carrier wafers / glass carrier wafers / automation systems / /

Organization

Task Force / Inspection & Metrology Task Force / SEMI / Thin Wafer Handling Task Force / /

Person

Shin-Etsu Polymer / Masahiro Tsuriya / Yutaka Koma / Sam Ko / Shoji Yasunaga / Hao Chen / Chris Moore / Arthur Chen / Roger Hwang / Wendy Chen / Victor Vartanian / Kazunori Kato / Richard Allen / Morihiro Kada / Jerry Yang / Shao Lai / /

Position

Leader / 3D-IC Study Group Leader / /

Technology

ASIC / CMP / /

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