San Francisco / Austin / Ft McDowell / Tainan City / Grenoble / Sn / /
Company
Ridge National Laboratory / Sandisk / EMC / Production Manager Extension Media LLC / FinFETs / AMD / Rudolph Technologies Inc. / Altera / GLOBALFOUNDRIES / MEMS Industry Group / GF / Contributing Editor 4 News 12 Semiconductors / Dow Corning / LG Electronics / Honeywell International Inc. / Extension Media LLC / Beijing KMT Technology Co. / United Microelectronics Corp. / IBM / Publisher Embedded Electronics Media Group / Samsung Electronics / Toshiba / Qualcomm / Intel / LTCC Sintering Press / Digital Media Ph / IBMs / /
Continent
ASIA / Europe / /
Country
France / Japan / Korea / Malta / Taiwan / Germany / United States / / /
Event
Business Partnership / Employment Change / /
Facility
National Institute / Justus Liebig University / University of Tennessee / University of Manchester / University Research Award / University of Hong Kong / Swiss Federal Institute of Technology Zurich / / /
IndustryTerm
design-for-manufacturing / much smaller and more diverse applications / chip technology / eWLB technology / density devices / clear infrastructure / Web Developer Dick James / downlight products / technology teams / package technology / chip manufacturers / energy-ef ficient devices / energy / speciļ¬c foundry site / 2D solutions / 14nm manufacturing / high-volume manufacturing / silicone technology / ONLINE CORPORATE OFFICERS Spryte Heithecker / magnetic logic device / consumer electronics / supply chain / silicon technologies / 3D using proprietary tools / spotlight products / electricity / fabless chip makers / technology information / manufacturing method / spin wave device / electronics / programmable logic technology / 20nm technology / diverse applications / conventional wafer level manufacturing / on-chip / 14nm products / measurement equipment / flip chip / technology workshops / multi-die devices / power devices / Web Exclusives / manufacturing process / metal / density laminate technology / 2D multi-chip systems / light energy / electronic devices / less energy / manufacturing / computing / metal gate height / Memory chips / memory solution / test equipment / respective manufacturing / potential solutions / Web Exclusives Moore / customer products / equipment suppliers / reticle-enhancement technologies / nano-scale computer chips / consumer computing device / product management / test chips / technology node / information-processing paradigms / wafer bumping applications / /
Organization
University of Washington / U.S. Department of Energy / MEMS Executive Congress Europe / Croucher Foundation / Research Grant Council of Hong Kong / Grant Council of Hong Kong / Shanghai First Intermediate Court / National Science Foundation / National Institute for Materials Science in Japan / University of Tennessee / office of Science / Semiconductor Industry Association / University of Hong Kong / Environmental Protection Agency / Justus Liebig University in Germany / University of Manchester / Swiss Federal Institute of Technology Zurich / Beijing KMT / University of Minnesota / /
Person
Steve Bezuk / Sr. / Kevin Low / Caldin Seides / Philippe Vereecken / Bangwon Oh / Wang Yao / Nicky Jacobson / Slava Dotsenko / Ana Hunter / JO NBOJQVMBUJPO PG FEHFMFTT XSBQQFE / John Hankinson / Takashi Taniguchi / Brandon Prior / Sachin Sapatnekar / Prismark / Phil Garrou / Bryan Black / Hughes Metras / Jean-Eric Michallet / Pete Singer / Xiaodong Xu / Kenji Kitamura / Kelvin Low / Clair Bright / Sara Ver-bruggen / Ronald Goldblatt / Perrine Batude / Jason Ross / Kenji Watanabe / Chun Wei Hsu / Aaron Jones / David Cobden / Ofer Adan / Roawen Chen / Shannon Davis / Vivek Bakshi / Ed Korczynski / Philip Klement / John Blyler / Jenna Johnson / Karen Lightman / Vince Ridley / / /
Position
Vice President / Singer / Editor-in-Chief / Senior Technical Editor / professor / imec / associate professor / KU Leuven / vice president of Technical Strategy and Operations / senior director / editor / Vice President and Chief Content Officer / supply chain model / acting president / Hunter / assistant professor / Vice President / Chief / director of NRE / President / senior director of marketing / Media Coordinator / senior vice president / LED strategic marketing team / VP of product management / Cu WB / Vice President / Business Development msterling@extensionmedia.com / VP / COB / still WB / existing foundry/fabless model / principal scientist / imec / associate professor / Graphic Designer / Editor-in-Chief / acting president and chief executive / /
Product
14nm / Pb / /
ProvinceOrState
California / Texas / Minnesota / Georgia / /
PublishedMedium
Nature Nanotechnology / /
Technology
same test chips / Although on-chip / high density laminate technology / programmable logic technology / blue LED chips / eWLB technology / FC package technology / semiconductors / test chips / alpha / GPS / 20nm technology / mobile device / Memory chips / lasers / Apple A7 processor / reticle-enhancement technologies / chip technology / three-dimensional silicon technologies / mobile phones / SRAM / integrated circuits / CMP / silicone technology / nano-scale computer chips / smartphone / Lithography / /
MAY 2014 VOL. 57 NO.3 Conceptual drawing of an electronic circuit comprised of interconnected graphene nanoribbons that are epitaxially grown on steps etched in silicon. Courtesy of John Hankinson, Georgia Tech. C OV E R