Cambridge / Beijing / Amsterdam / Changchun / New York / /
Company
Ó 2012 Acta Materialia Inc. / Elsevier Ltd. / Equipment Co Ltd. / McGraw-Hill / /
Country
Taiwan / Japan / United States / / /
Facility
Shanghai Jiaotong University / College of Engineering / Beijing Institute of Control Engineering / Massachusetts Institute of Technology / Nihon University / /
IndustryTerm
creep constitutive law / constitutive law / microelectromechanical systems / power law / /
Organization
National Natural Science Foundation of China / Nihon University / Division of Applied Physics / Department of Engineering Mechanics / College of Engineering / Singapore-MIT Alliance / People’s Republic of China Department of Materials Science and Engineering / Shanghai Jiaotong University / Shanghai / Beijing Institute of Control Engineering / China Scholarship Council / Massachusetts Institute of Technology / /
Available online at www.sciencedirect.com Scripta Materialia[removed]–610 www.elsevier.com/locate/scriptamat Low-temperature creep of SnPb and SnAgCu solder alloys