IC / Lockheed Martin / ACI Technologies Inc. / ITT Industries / BGA Manufacturing / The Boeing Company / EMPF / Northrop Grumman / Issue Affordable Manufacturing / Affordable Manufacturing / BAE Systems / Rockwell Collins / Bogus! Electronic Manufacturing / Raytheon / Counterfeit Electronics / Honeywell / /
Country
Thailand / /
Currency
USD / / /
Event
Product Issues / Business Partnership / /
Facility
International Airport / International Plaza / / /
IndustryTerm
selective solder equipment / technology insertions / fine leak equipment / manufacturing assistance / manufacturing process plan / finished product / electronics manufacturing operations / electronic manufacturing support / manufacturing engineers / metal cover / high volume manufacturing / selective soldering equipment / manufacturing flow / wave soldering equipment / lean manufacturing techniques / authorized distributor / naval equipment / electronics assembly plants / capitol equipment / Electronic systems / defense applications / manufacturing processes / manufacturing process / defense systems / manufacturing bottlenecks / shipboard electronics / assembly manufacturing processes / mixed technology board containing / wave solder equipment / telecommunications / hybrid manufacturing processes / telecommunications industry fiber optics / electronic devices / manufacturing / memory chips / radar applications / software combination / appropriate hardware / board systems / metal enclosures / efense systems / industry technology / parts brokers / manufacturing costs / semiconductor devices / inspection systems / Defense electronics manufacturers / Manufacturing technologies / fiber optic network / metal casing / shipboard communications / time designing products / capable communications / surface mount technology / technology¹ / manufacturing process steps / production wave solder equipment / chemical re-surfacing technique / state devices / ship board electronics / manufacturing time / connection devices / through-hole technology / mixed technology / manufacturing techniques / electronics / Ceramic substrate manufacturing / electronic manufacturing / jet dispensing technology / hermetic packaging technologies / mix applications / /
Organization
Electronics Association / Industrial Advisory Board / Senate Armed Services Committee / Navy / RF Circuit Board Assembly / National Electronics Manufacturing Center of Excellence / JEDEC Solid State Technology Association / Department of Defense / /
Person
Paul Bratt / Dennis M. Kox / Mike Prestoy / Gary Kirchner / Fred Verdi / Sanjay Tiku / Andrew Paradise / Gregory X. Krieger / Edward A. Morris / Ask / Jane Krueger / Phillip Yu / Michael D. Frederickson / Gerald R. Aschoff / Carl Levin / Anand Bhavankar / Barry Thaler / / /
Position
Packaging Engineer / General / Materials Engineer / military contractor / bthaler@aciusa.org EMPF Technical Director Empfasis Technical Editor / Manufacturing Engineer / Editor / Senior R&D Engineer / manager / Director / Registrar / Senior Applications Engineer / /
Product
Joint Strike Fighter / wire bonds / parts / missing silicon dies / /
ProgrammingLanguage
php / /
ProvinceOrState
Pennsylvania / /
PublishedMedium
Science News / /
Technology
Manufacturing technologies / 22 Chip / X-ray / surface mount technology / hermetic packaging technologies / semiconductors / system technologies / CAD / nine Navy Manufacturing Technology / semiconductor devices / through-hole technology / microwave / fiber optic / memory chips / Ethernet / Laser / Packaging Technology / often mixed technology / Joint Strike Fighter System-on-Chip / System-On-Chip / dielectric / industry technology / radio frequency / electrooptical assemblies WDM technology / jet dispensing technology / /
empfasis A publication of the National Electronics Manufacturing Center of Excellence MarchAffordable Manufacturing of WDM