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TSMC VISION & CORE VALUES TSMC’s Vision Table of Contents 1. Letter to Shareholders
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Document Date: 2011-08-09 06:34:07


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City

European / Hsinchu / /

Company

Taiwan Stock Exchange / IC / Directors TSMC / British Telecommunications / Advanced Micro Devices Inc. / Qualcomm Inc. / Freescale Semiconductor Inc. / Analog Devices Inc. / Customer Partnership Customers TSMC / MediaTek Inc. / Market Overview 6 Our / Stion Corporation / Motech / New York Stock Exchange / Texas Instrument Inc. / Broadcom Corporation / TSMC China Company Limited. / Marvell Semiconductor Inc. / Texas Instruments Inc. / NVIDIA Corporation / IP / Altera Corporation / NXP Semiconductors / /

Continent

Europe / North America / /

Country

Japan / Taichung / China / India / Taiwan / United States / South Korea / /

Currency

USD / TWD / /

Event

Earnings Announcement / Business Partnership / Environmental Issue / M&A / Company Listing Change / Company Expansion / /

Facility

Taiwan Institute / Institute of Electrical / Total foundry / /

IndustryTerm

process technologies / technology licensing / interconnect technologies / direct-write technologies / wide-ranging needs / digital consumer products / technology development / electronics devices / manufacturing facilities / risk management / network processors / manufacturing customers / large-scale manufacturing / manufacturing processes / real-time basis / fab manufacturing management system / foundry services / metal / 85nm low power technology / quality management / semiconductor supply chain / continuous energy efficiency improvement / logic process technology / node technology / multi-time programmable non-volatile memory technology / manufacturing infrastructure / account management / manufacturing sub-segment / 28nm technology / gate-last high-k metal-gate process / information technology / manufacturing fabs / solar business production site / silicon germanium technologies / energy efficiency / 28nm process technologies / manufacturing / solar energy market / computing / technology leadership / energy-conservative designs / materials handling systems / 40nm general purpose technology / few customer products / manufacturing strategy / solar cell manufacturer / high-k metal gate processes / technology revenue / market semiconductor products / consumer electronics markets / wireless connectivity solutions / green energy industries / business law / digital power management / scanner technology / upstream supplier / manufacturing solutions / 90nm eFlash technology / internal auditors / technology nodes / internal control systems / technology base / Real-time equipment productivity monitoring / technology challenge / process technology productions / consumer products / technology / industrial products / materials management / owned subsidiaries / semiconductor manufacturing industry / manufacturing excellence / handheld high-end applications / /

MarketIndex

Dow Jones Sustainability / /

Organization

New Businesses / Compensation Committee / first Thin Film Solar R&D Center / Corporate Governance Board of Directors TSMC / Operational Highlights Technology Leadership R&D Organization / Ministry of Economic Affairs / Soft IP Alliance / Institute of Electrical and Electronics Engineers / Highlights Technology Leadership R&D Organization / Taiwan Semiconductor Industry Association / WSC / Taiwan Institute for Sustainable Energy / TSMC’s IP Alliance / Environmental Protection Agency / /

Person

Stan Shih / Fab / Peter Bonfield / Thomas J. Engibous / Morris Chang / /

Position

Chief Executive Officer / Chairman and CEO / Semiconductor Sector Leader / worldwide leader in the semiconductor sector / Senior Vice President of R&D / Chairman Acer Group / government official / leader in the foundry segment / consultant / Chairman / good model / attesting CPA / smart phone display driver / controller / Chairman of the Board / Acer Group Chairman / /

Product

Harman On Time Radio / /

PublishedMedium

FinanceAsia / /

Region

Asia Pacific / Central Taiwan / /

Technology

193nm high-NA scanner technology / FPGA / 28nm process technologies / information technology / 85nm low power technology / massively parallel E-Beam direct-write technologies / photolithography / node technology / 28-nanometer technology / multi-time programmable non-volatile memory technology / 157 technologies / purpose technology / 55nm low power RF technology / MEMS / 7-nanometer technologies / 28nm technology / Flash / 90nm eFlash technology / 14-nanometer technologies / semiconductor / network processors / smart phone / CIGSS technology / lithography / RF technology / silicon germanium technologies / application processor / high end System-on-Chip / Mobile computing / process technologies / 40/45-nanometer technology / radio frequency / logic process technology / Gigabit Ethernet / /

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