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Electronics / Electronic engineering / Industrial engineering / Three-dimensional integrated circuit / Heat sink / Packaging and labeling / Technology / Integrated circuits / Semiconductor device fabrication


Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D Ics Kamal Karimanal Cielution LLC
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Document Date: 2014-01-22 10:41:49


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File Size: 1,10 MB

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