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Date: 2017-03-20 07:48:05 | Electroless and electrolytic copper plating of glass interposer combined with metal oxide adhesion layer for manufacturing 3D RF devices Zhiming Liu, Hailuo Fu, Sara Hunegnaw, Jun Wang, Michael Merschky, Tafadzwa MagayaAdd to Reading ListSource URL: www.atotech.comDownload Document from Source WebsiteFile Size: 2,55 MBShare Document on Facebook |