Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

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Date: 2016-07-20 11:09:32 Semiconductor device fabrication Materials science Technology Electronic engineering Wafer Silicon on insulator Acoustic microscopy Integrated circuit Three-dimensional integrated circuit Soitec Smart cut		Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging Janet E. Semmens and Bryan P. Schackmuth Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 295,66 KB Share Document on Facebook

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