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Document Date: 2009-02-06 04:16:23Open Document File Size: 407,96 KBShare Result on FacebookCompanyIntel Corporation / Pentium / /CountryUnited States / /IndustryTermlife sustaining applications / changes to specifications and product / Component thermal solutions / package technology / appropriate processor / /Technologypackaging technology / appropriate processor / 1.3 Description LGA775 Socket Processor / 4 processor / Flip-Chip Land Grid Array package technology / 1 Processor / /URLhttp /SocialTag |