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Date: 2016-07-20 11:09:32 | Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green StreetAdd to Reading ListSource URL: www.sonoscan.comDownload Document from Source WebsiteFile Size: 861,19 KBShare Document on Facebook |