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Microscopy / Electronics manufacturing / Manufacturing / Economy / Business / Acoustic microscopy / Flip chip / Solder / Reliability / Integrated circuit / Bump / Microscope


CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.
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Document Date: 2016-07-20 11:09:32


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File Size: 1,03 MB

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