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Manufacturing / Solderability / Solder / Printed circuit board / Surface-mount technology / Flux / Restriction of Hazardous Substances Directive / Reflow soldering / Chip carrier / Electronics manufacturing / Electronics / Electromagnetism


IPC/ECA J-STD-002C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES ® Solderability Tests for Component Leads,
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Document Date: 2010-02-18 12:39:12

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File Size: 41,45 KB

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City

Bannockburn / Bath / Arlington / /

Company

002C ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES / Wire Solderability Specification Task Group / IPC Wetting Balance Task Group / /

Facility

Acceptable Solderable Terminal / Unsolderable Terminal / /

/

MarketIndex

IPC 3000 / /

NaturalFeature

Mount Process Simulation Test Leadfree Solder / Mount Process Simulation Test Tin/Lead Solder / /

Organization

International Electrotechnical Commission / Soldering Technology Committee / Joining Processes Committee / Electronic Components / Assemblies and Materials Association / /

/

ProgrammingLanguage

C / /

ProvinceOrState

Illinois / Virginia / /

Technology

Simulation / process control / /

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