Endicott / Piscataway / Dresden / Kyoto / Tempe / Berlin / Phoenix / Madras / Gießen / Waltair / Kuala Lumpur / Orlando / New York / /
Company
Control Data Corporation / Electronics Engineers Inc. / Freescale Semiconductor Inc. / IMAPS / CPMT Society / Trans / United Engineers and Constructors / Philips / IBM Corporation / Sandia Labs / Microperipheric Technologies / Freescale Inc. / Chrysler / IEEE CPMT Society Newsletter 2 / Packaging Technologies / IEEE CPMT Society / IEEE Transactions / Motorola Inc. / Agilent Technologies / Manufacturing Technology / Electronic Packaging Technologies / Components & Packaging Technologies / CPMT Officers / Chip Interconnection Technologies / Bayer / Raytheon Corporation / Alcatel / Electronic Packaging Laboratory / Intel / IEEE CPMT Society Welcome / Section and Chapter / /
Continent
America / Asia / Europe / /
Country
Norway / Israel / Malaysia / Japan / Canada / India / Germany / United States / Singapore / /
Currency
USD / / /
EntertainmentAwardEvent
Directors for Awards / Director / Awards / /
Event
Business Partnership / Employment Change / /
Facility
Hong Kong University of Science / Purdue University / Auburn University / Technical University of Berlin / Sheraton San Diego Hotel / IBM T.J. Watson Research Center / Massachusetts Institute of Technology / University of Applied Science / Ben Gurion University / ASME’s Nanotechnology Institute / Research Center / Fraunhofer Institute / University of Texas / Andhra University / Advanced Materials Institute / Institute of Electrical / University of Gießen / Kansas State University / University of Minnesota / University of Maryland / University of Pennsylvania / / /
Materials Association / EPACK Lab / University of Texas at Austin / University of Maryland / Univ of Alabama / Ben Gurion University / Hong Kong CPMT Chapter / Distinguished University / Advanced Materials Institute / Massachusetts Institute of Technology / Editorial Advisory Board / ASME’s Nanotechnology Institute / Research Center for Microperipheric Technologies / Manufacturing Technology Society / Components / Packaging / and Manufacturing Technology Society / IEEE CPMT Society Santa Clara / IBM Academy of Technology / Hong Kong Univ of Science & Technology / Institute of Electrical / University of Gießen / Malaysia Chapter / University of Pennsylvania / Manufacturing Technology Committee / SUNY / Hong Kong University of Science & Technology / Steering Committee of ASME / Kong Chapter / Purdue University / Package Assembly / Nano and Advanced Materials Institute / Technical University of Berlin / Kansas State University / Electronic Industries Alliance / Andhra University / Nano / Auburn University / 60th Chinese Association for Science / Singapore CPMT Chapter / Fraunhofer Institute / ASME Electronic & Photonic Packaging Division / University of Applied Science / ECTC committee / Univ. of Maryland / European Union / Institute of Electrical and Electronics Engineers / Phoenix Chapter / Santa Clara Valley Chapter / Naval Postgraduate School / National Laboratory / Assembly for International Heat Transfer Conferences / Fraunhofer Institute for Reliability and Microintegration Berlin / Hong Kong Government / IC / National Aeronautics and Space Administration / IEEE Rel/CPMT/ED Singapore Chapter / University of Texas at El Paso / University of Minnesota / Electronic Components / Assemblies / and Materials Association / /
Person
Todd Bayer / Michael McShane / Bill Moody / Dan Brown / Charles Lee / Dave Palmer / Karel Capek / Minnie Mouse / David W. Palmer / Sowbha / Michael Lebby / John Segelken / Yoshitaka Fukuoka / Rao Tummala / Connie Swager / Rao Bonda / Bill Chen / N. Rao Bonda / Patrick Thompson / T. Chen N.Rao / Ricky S.W. Lee / Region / William T. Chen / Rolf Aschenbrenner / Frank Schätzing / Eric Perfecto / Andrew Skipor / Marsha S. Tickman / Vasudeva P. Atluri / Kitty Pearsall / Susan Law / Ron Gedney / Pradeep Lall / Shi-Wei Ricky Lee / Hieronymus Bosch / Jeffrey C. Suhling / Reichl / Li Li / Koneru Ramakrishna / Currently Ricky / Richard C. Jaeger / M. Kaysar Rahim / C.P. Wong / Johan Liu / Madhavan Swaminathan / Ralph Russell / II / Kirk Gray / N.Rao Bonda Thomas / Rajen Chanchani / Tony Mak / Ephraim Suhir / William D. Brown / Bruce Kim / David Palmer / Martin Goetz / Paul B. Wesling Rolf Aschenbrenner Albert / Phil Garrou / / /
Position
ECTC Vice General Chair / Exec. / Vice President / ECTC General Chair / General Co-Chair / Editor in Chief / Associate Professor of Mechanical Engineering and Director / Materials Engineer / Secretary / Director Strategic Program / author / Distinguished Engineer / ECTC Program Chair / Vice President / Technical / Director Board of Governors Marsha S. Tickman Executive / Strategic Director / Director Technology / licensed Professional Engineer in the State of Texas / Associate Newsletter Editor Editor / team leader / Editor / Program Chair / Director / Awards Strategic Program / Editor-in-Chief / Newsletter Editor Editor / keynote speaker / Fellow President / head of the department / Technical Chair and General Chair / General Chair at EPTC Conferences / President / Professor and Chair / Member of Technical Staff / ECTC Lunch Speaker / The Vice General Chair / Program Co-Chair / Executive / Award Winners President / general chair / VP / Vice-President / Chief Engineer / Vice President Conferences / Technical VP / physicist / artist / Deputy Director / Director / Consulting Engineer / newsletter editor / Chair / ASME representative for the US / Member at Large / licensed Professional Engineer / member / /
ProgrammingLanguage
Joule / /
ProvinceOrState
California / Arizona / Texas / New Jersey / Pennsylvania / Delaware / Massachusetts / Minnesota / New York / Mississippi / Maryland / /
PublishedMedium
the Society / /
Region
Southern Germany / Asia Pacific / Northern California / /
SportsEvent
The World Cup / the 2006 World Cup / World Cup Championship / /
Technology
radiation / optoelectronics / semiconductor / biotechnology / streaming video / IC technology / dielectric / condensation / Simulation / Heat Transfer / photolithography / high density interconnect technology / MEMS / /
IEEE Components, Packaging and Manufacturing Technology (CPMT) Society