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Microsoft Word - 2_29_Rolf_Aschenbrenner_ABSTRACT_BIO.docx
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Document Date: 2015-04-13 05:43:25

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File Size: 41,46 KB

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Company

Interconnection Technologies / IEEE CPMT / /

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Facility

Fraunhofer Institute / /

IndustryTerm

panel-level packaging technologies / System integration technologies / wireless networks / cyber-physical systems / /

Organization

Fraunhofer Institute for Reliability and Microintegration Berlin / Conference Advisory Board Committee / IEEE CPMT Society Board / Fraunhofer Institute for Reliability and Microintegration / /

Person

Rolf Aschenbrenner / D. Lang / /

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Position

Vice President / Technical and IEEE CPMT Vice President / Conferences / representative / President / Director / Deputy Director / Dept. SIIT / Deputy Director and head of the department / /

Technology

Wafer-level and panel-level packaging technologies / System integration technologies / /

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