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Image sensors / Digital photography / Noise / Image processing / Infrared imaging / Analog-to-digital converter / Staring array / Pixel / Signal-to-noise ratio / Electronics / Optics / Technology


Digital-Pixel Focal Plane Array Technology Kenneth I. Schultz, Michael W. Kelly, Justin J. Baker, Megan H. Blackwell, Matthew G. Brown, Curtis B. Colonero, Christopher L. David, Brian M. Tyrrell, and James R. Wey Lincoln
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Document Date: 2015-01-08 08:19:08


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File Size: 1,64 MB

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City

Boston / /

Company

IBM / James R. Wey Lincoln Laboratory / LINCOLN LABORATORY JOURNAL / Intel / DROIC FEATURES CURRENT FUTURE Manufacturing / /

Facility

MIT campus / /

IndustryTerm

metal / high-update-rate imaging / on-chip processing capabilities / detector technologies / thermal imaging sensor / real-time digital image processing capability / focal plane array technology / conventional technologies / high-capacity image processing / sensor systems / detector technology / Given technology limitations / thermal imaging systems / wide-area imaging system / aerial search / imaging / image-based sensor systems / /

Organization

MIT / US Federal Reserve / /

Person

Matthew G. Brown / Infrared Imagery / Justin J. Baker / Kenneth I. Schultz / Brian M. Tyrrell / Megan H. Blackwell / Michael W. Kelly / Christopher L. David / Curtis B. Colonero / /

Position

representative / /

Technology

semiconductor / radiation / ADC / remote sensing / Conventional Focal Plane Array Technology / hybridization / analog-to-digital conversion / detector technologies / conventional analog ROIC technology / detector technology / Integrated Circuit Technology / DFPA technology / image processing / focal plane array technology / 37 DIGITAL-PIXEL FOCAL PLANE ARRAY TECHNOLOGY / DSP / Image Stabilization / flash / integrated circuit / digital photography / /

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