Date: 2015-07-18 01:30:09Electronics manufacturing Electronic design Ball grid array Surface-mount technology Solder Field-programmable gate array Printed circuit board Restriction of Hazardous Substances Directive Xilinx Automated X-ray inspection Physics of failure System on a chip | | A Low-Power Sensor Design, SJ Monitor, for Monitoring 24x7 the Health of BGA Solder JointsDocument is deleted from original location. Use the Download Button below to download from the Web Archive.Download Document from Web Archive File Size: 846,70 KB
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