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Electromagnetism / Solder / Surface-mount technology / Ball grid array / Printed circuit board / Integrated circuit packaging / Wave soldering / Automated X-ray inspection / Reflow soldering / Electronics manufacturing / Electronics / Electronic engineering


Converting Ball Grid Array Components to Column Grid Array Russell T. Winslow Six Sigma
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Document Date: 2006-09-14 20:59:04


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File Size: 2,16 MB

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City

New York / /

Company

IBM / M. S. Cole / Lockheed Martin / Six Sigma / C. G. Heim / Raychem Corporation / A. Caron / Tyco / Space Electronics / Winslow Automation Inc. / Motorola / R. H. Lewis / McGraw-Hill / Applied Material Technologies / /

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Event

M&A / /

Facility

Georgia Institute of Technology / /

IndustryTerm

solder column technologies / electronics upgrades / reliability systems / electronics applications / important technology / electronics industry / daisy-chain devices / Column grid array technology / array packaging technology / harsh environment applications / /

NaturalFeature

Mount LCCCs / /

Organization

Georgia Institute of Technology / eta / Second Level Assembly of Column Grid Array Packages / /

Person

R. David Gerke / Gabe Cherian / Suresh K. Sitaraman / Daisy ChainAnatech / T. Winslow Six Sigma Milpitas / Andy Perkins / Russell T. Winslow / /

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Position

Acknowledgments The author / /

ProvinceOrState

New York / /

RadioStation

AM 1.00 / /

Technology

CCMD technology / important technology / Column grid array technology / solder column technologies / Workshop Abstract Area array packaging technology / Column Grid Array History The technology / BGA technology / /

URL

www.Weibull.com / www.sixsigmaservices.com / /

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