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Apple iPhone 6 & 6 Plus Front Camera Modules from Sony Very Innovative CMOS Image Sensor: new pixel array structure / Stacked ISP circuit based on Exmor-RS process/ manufacturing cost adapted to camera performances For t
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Document Date: 2015-08-04 06:48:02

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City

Lyon / /

Company

Compound Semiconductors / Lyon France Bank / AMEX / Sony / HSBC / Power Electronics / CSC / Apple / Micronews / /

Country

France / /

Currency

EUR / /

/

Event

Product Issues / /

Facility

France headquarters / /

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IndustryTerm

technology analysis / local area network / technology industrial projects / finance services / cost simulation tools / bank transfer / defective products / copyright law / search service / flip-chip / manufacturing cost / technology trends / 65nm technology node / micro manufacturing / device manufacturing cost / market research / retrieval systems / online service / /

Organization

etc / European Union / /

Person

Nano / Yole Développement / David Jourdan / /

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Position

analyst / /

Product

iPhone / CMOS Image Sensor / Apple iPhone / products / formatting / product ’ s electronic delivery format / /

Technology

LAN / MEMS / X-Ray / http / ISP / simulation / SRAM / Microfluidics / Pdf / /

URL

www.yole.fr / www.yole.fr/Terms_and_Conditions_of_Sale.aspx / www.imicronews.com / www.i-micronews.com/reports / /

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