| Document Date: 2009-03-25 10:37:00
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Company Mitsubishi / IBM / Fujitsu / NEC / Infineon Technologies / Sony / Lucent / Ericsson / IC TECHNOLOGY INTEGRATION Partners / Motorola / Honeywell / Toshiba / CHIPIDEA CISSOID Ericsson AB / Texas Instruments / AMD / Philips / STMicroelectronics / Intel / / Continent Europe / / / Facility ACP CEA-DAM CEA-LETI Chalmers University of Technology CHIPIDEA CISSOID Ericsson / / / IndustryTerm technology stage / substantial / mobile and networking devices / sub-90nm devices / sumer electronics markets / manufacturing process / large volume devices / wireless local area network / Wireless Solutions / production chain / electronics industry / wafer manufacturer / public networks / passive devices / near telecommunications systems / plain silicon manufacturing techniques / equipment / 120nm technology / / Organization Information Society / Chalmers University of Technology / MEDEA+ Office / FD SOI / ACP CEA-DAM CEA-LETI Chalmers University / / / Position Project leader / leader / Major / co-operative / / PublishedMedium the Information Society / / Technology semiconductor / SOI technologies / 45nm chip / CMOS technologies / SOI technology / BiCMOS technology / microwave / main European chip / buried Cut technology / high speed BiCMOS technologies / one chip / CMOS RF 120nm technology / enabling technology / CMOS SOI chips / SOI-based chips / / URL http /
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PROJECT PROFILE T206: CMOS SOI for low power logic and RF wireless (CMOSSOI) IC TECHNOLOGY INTEGRATION