| Document Date: 1998-06-11 16:33:26
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City Packaging Handbook / Boston / Boxboro / / Company Houghton Mifflin Company / Hewlett Packard / Formcast Inc. / LSI / McGraw-Hill Inc. / Advance Die Casting Company / Dow Chemical / Aravalda Corp. / / Currency USD / / Facility Chapel Hill / Microelectronics Systems Laboratory University of North Carolina / North Carolina State University / / IndustryTerm metal / weightsensitive equipment / pot metal / medium and high volume heatsink applications / stereo systems / secondary manufacturing steps / long life steel mold / power devices / transportation systems / copper backed chip carrier packages / steel eliminating / Secondary processing / high volume heatsink manufacturing methods / automotive electronics / transportation equipment industry / cost external heatsink manufacturing process / high volume manufacturing processes / medium powered chips / manufacturing methods / electronics / forced air systems / transportation industry / temperature devices / heatsink manufacturing methods / electrical equipment / electronic manufacturing industry / automotive applications / manufacturing economies / electronic cooling applications / steel / / NaturalFeature Chapel Hill / / Organization University of North Carolina / North Carolina State University / / Person Eugene J. Rymaszewski / Joni Julian / Paul K. Trojan / Van Nostrand Reinhold / / Position Editor / Compliance Engineering / / ProgrammingLanguage C / / ProvinceOrState North Carolina / New York / Massachusetts / / Technology medium powered chips / Heat Transfer / /
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Low Cost, High Performance, High Volume Heatsinks Kurtis Keller Computer Science – Microelectronics Systems Laboratory University of North Carolina at Chapel Hill, USA ABSTRACT Higher-powered electronics are being inte