Back to Results
First PageMeta Content
Passive fire protection / Heat transfer / Heat conduction / Semiconductor packages / TO-220 / Thermal management of electronic devices and systems / Heat sink / Thermal resistance / Thermal conductivity / Mechanical engineering / Chemistry / Chemical engineering


Efficiency and Cost Tradeoffs Between Aluminum and ZincAluminum Die Cast Heatsinks Kurtis P. Keller University of North Carolina, Computer Science Department Chapel Hill, NC[removed], USA
Add to Reading List

Document Date: 1998-06-11 16:11:38

Open Document

File Size: 121,00 KB

Share Result on Facebook

City

Packaging Handbook / Boston / Boxboro / /

Company

Houghton Mifflin Company / Formcast Inc. / LSI / Commercial Packaging Solutions / McGraw-Hill Inc. / Hewlett Packard Corporation / Advance Die Casting Company / Dow Chemical / Aravalda Corp. / /

Currency

USD / /

Facility

ZincAluminum Die Cast Heatsinks Kurtis P. Keller University of North Carolina / North Carolina State University / /

IndustryTerm

power applications / manufacturing process design rights / day electronics packaging / moderate-to-higher power applications / spaced chips / processor chips / electronic equipment / fluid dynamic and thermodynamic software / non-steel molds / manufacturing cost / chip carrier / manufacturing / medium power chips / air cooling systems / /

NaturalFeature

Chapel Hill / /

Organization

University of North Carolina / U.S. Patent & Trademark Office / North Carolina State University / /

Person

Kurtis / Eugene J. Rymaszewski / John Poulton / Sherry Palmer / Paul K. Trojan / Van Nostrand Reinhold / /

Position

Editor / Compliance Engineering / engineer / /

ProvinceOrState

North Carolina / New York / Massachusetts / /

Technology

medium power chips / closely spaced chips / Heat Transfer / simulation / processor chips / /

SocialTag