Taiwan Stock Exchange / British Telecommunications / TSMC Solid State Lighting Ltd. / GPU / Business Development Dr. C.C. / TSMC Solar North America / Operations Dr. Mark Liu / Lighting Ltd. / Market Overview 6 Our / R&D Dr. Shang / New York Stock Exchange / Texas Instrument Inc. / Corporate Governance Asia / Institutional Investors / Apple / TSMC China Company Limited. / TSMC Solar Ltd. / TSMC Solid State / Micro Electro Mechanical Systems / Lending Funds / /
Continent
Europe / Asia / North America / /
Country
Thailand / Japan / China / India / Taiwan / United States / South Korea / /
Currency
USD / TWD / /
Event
Company Expansion / Earnings Announcement / Natural Disaster / Dividend Issuance / Company Listing Change / General or Shareholder Meeting / Earnings Guidance / /
Facility
Princeton University / IC foundry / Total foundry / /
IndustryTerm
process technologies / manufacturing efficiencies / mainstream technology research / handheld applications / generic technology / wide-ranging needs / technology business strategy development / power sensitive applications / back-end technology / technology development / electronics devices / manufacturing facilities / finance / manufacturing customers / manufacturing processes / downstream chain / mobile computing / foundry services / designer/developer support services / 85nm low power technology / quality management / mobile applications / microcontroller applications / logic process technology / Wireless Local Area Network / semiconductor technologies / Internet Devices / account management / mixed-signal applications / manufacturing sub-segment / mobile computing products / electronics industry / consumer electronics products / silicon germanium technologies / manufacturing / computing / investment management / mobile computing applications / technology leadership / intellectual property management / consumer electronics / 40nm general purpose technology / complicated software / electronics markets / industrial related products / market semiconductor products / yield management / resources management / wireless connectivity applications / tablet products / digital consumer applications / high-k/metal / functional and virtual fabrication services / digital power management / 90nm eFlash technology / internal auditors / reliability management / internal control systems / driver chip / communication infrastructure / long and complex supply chain / 3D chip / consumer products / design 3D chip / eFlash technology / 65nm technology / logic chip / 20nm technology / public relations / industrial products / owned subsidiaries / non-volatile memory technologies / logic technology / process compliance audit / speed networking applications / manufacturing stage / /
MarketIndex
Dow Jones Sustainability / /
MusicAlbum
Asia / /
MusicGroup
Board of Directors / /
Organization
Compensation Committee / Princeton University / Accelerated Processing Unit / Corporate Planning Organization / ASIC / Taipei City Government / Quality and Reliability Note / Central Processing Unit / Taiwan government / Operations Audit Committee Compensation Committee Board of Directors Chairman Vice Chairman Product / Board of Directors In / Special Board / Regular Board / Quality / Customer Trust / /
Person
Peter Leahy Bonfield / Stan Shih / Peter Bonfield / Gregory C. Chow / Yuan / Cliff Hou / Kok-Choo Chen / Thomas J. Engibous / Y. J. Mii / Burn Lin / Morris Chang / /
Position
Chairman and Chief Executive Officer / Vice President / Chief Executive Officer / Vice President of Design and Technology Platform / Spokesperson Corporate finance / Vice President of R&D / Professor / designer / Executive / Major / Executive Vice Presidents and Co-Chief / Chairman Acer Group / driver / strong growth driver / Corporate spokesperson / leader in the foundry segment / consultant / leader in the semiconductor foundry segment / Chairman / Senior Vice President / advisor to the Taiwan Executive Yuan / attesting CPA / CEO Information Technology Technology system integration / HD720 display driver / Major Corporate Functions Organization Chart Research and Development Advanced and mainstream technology research / growth driver / controller / Spokesperson Co-COO Office / Acer Group Chairman / Chairman of the Board / /
Product
CMOS 3D MEMS platform / CoWoSTM / 3D MEMS (Micro Electro Mechanical Systems) platform / iPad / CMOS 3D MEMS / 3D MEMS / /
ProvinceOrState
California / /
PublishedMedium
the IR Magazine / /
Region
Asia Pacific / /
Technology
FPGA / application processors / IC design 3D chip / Information Technology / separate ASIC driver chip / non-volatile memory technologies / 85nm low power technology / analog technologies / Operating System / 3D chip / back-end technology / purpose technology / 55nm low power RF technology / semiconductor technologies / corporate 28-nanometer Gate-Last HKMG logic technology / 3G / flash / logic chip / semiconductor / Disk Drive / System-on-a-Chip / 20nm technology / RF technology / CEO Information Technology Technology / ASIC / silicon germanium technologies / Achievements 90nm eFlash technology / application processor / WLAN / System-on-Chip / eFlash technology / Digital TV / smartphones / mobile computing / process technologies / radio frequency / 65nm technology / logic process technology / Gigabit Ethernet / /
● ● TSMC’s shares are listed on the Taiwan Stock Exchange (TSE) under the code[removed]Depositary receipts of the common shares are listed on the New York Stock Exchange (NYSE) under the symbol TSM.