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![]() | Document Date: 2012-04-10 13:51:59Open Document File Size: 4,52 MBShare Result on FacebookCitySilicon Valley / /CompanySTATS ChipPAC Taiwan Semiconductor Corporation / Temasek Holdings (Private) Limited / LSI Corporation / Analog Devices / Intel Corporation / ChipPAC Ltd. / DISCUSSION AND ANALYSIS CORPORATE / Cirrus Logic / Singapore Exchange Securities Trading Limited / Samsung Semiconductor / STATS ChipPAC / /ContinentAsia / Europe / /CountryTaiwan / Switzerland / Thailand / Malaysia / Japan / United States / United Kingdom / China / Singapore / South Korea / /CurrencyUSD / /EventLayoffs / Natural Disaster / Earnings Announcement / Company Listing Change / Force Majeure / /FacilityThailand facility / /IndustryTermtechnology innovation / multi-site / fine pitch devices / portable products / technology solutions / supply chain / manufacturing presence spanning / flip chip / communications equipment / higher processing capabilities / manufacturing locations / packaging solutions / manufacturing capabilities / density wafer level packaging solutions / multi-applications / diverse end market applications / flip chip packaging technology / consumer applications / computing / business interruption insurance claim / fcCuBE™ technology / test technology / differentiating technology / wireless handset market / media tablets / multi-functional electronic devices / process technology capabilities / /OrganizationBOARD OF DIRECTORS SENIOR MANAGEMENT MANAGEMENT DISCUSSION AND ANALYSIS CORPORATE GOVERNANCE DIRECTORS / /PersonTan Lay Koon / Charles R. Wofford / /Positionleader / Chairman / Director / President and Chief Executive Officer / /ProvinceOrStateTexas / Hsin-Chu District / California / Arizona / Massachusetts / /Technologysemiconductor / fcCuBE™ technology / semiconductors / flip chip packaging technology / test technology / smartphones / /URLwww.statschippac.com / /SocialTag |