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Computing / NEC / Computer architecture / Cell / Central processing unit / FLOPS / NEC SX-9 / NEC SX-8 / Computer hardware


Supercomputer SX-9 Hardware Packaging Technology of the SX-9 UMEZAWA Kazuhiko, HAMAGUCHI Hiroyuki, TAKEDA Tsutomu HOSAKA Tadao, NATORI Masaki, NAGATA Tetsuya Abstract
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Document Date: 2012-09-11 09:43:22


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File Size: 1,27 MB

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Company

LSI / NEC Design Ltd. / NEC Corporation / NEC Computertechno Ltd. / /

Event

Product Release / /

IndustryTerm

sheet metal / black paint / paint workshop / gloss paint / attractive products / environmental consideration computer product / efficiency packaging technology / press processing technology / power supply technology / density connection technology / fabrication technologies / /

Organization

1st Computers Operations Unit / CPU LSI / /

Person

Tetsuya Abstract / /

Position

Designer / Second Product Design Dept. / Assistant Manager / Computers Division / Chief Manager / Computers Division / TAKEDA Tsutomu Assistant Manager / Computers Division / Manager / Computers Division / /

Product

SX-9 / 48V DC power supply system / Supercomputer SX Series / 48V DC / /

ProgrammingLanguage

DC / /

Technology

Improved fabrication technologies / High-density Packaging Technology / shared memory system / 3.2 Connection Technology / laser / packaging technology / power supply technology / 2.2 Wiring Board Technology / Cabinet Technology / 31 Supercomputer SX-9 Hardware Packaging Technology / dielectric / Keywords packaging technology / high-efficiency packaging technology / shared memory / press processing technology / packaging technologies / high-density connection technology / 29 Supercomputer SX-9 Hardware Packaging Technology / System Packaging Technology / Supercomputer SX-9 Hardware Packaging Technology / /

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