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Chemical engineering / Thermotunnel cooling / Heat sink / Electric resistance welding / Thermal management of electronic devices and systems / Light-emitting diode / Electronic engineering / Passive fire protection / Mechanical engineering / Welding


DEVELOPMENT OF A HIGH-EFFICIENCY SOLID-STATE COOLING CHIP Remarks of Rodney T. Cox
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Document Date: 2006-06-01 21:30:50

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File Size: 85,94 KB

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City

Palo Alto / /

Company

IBM / Cool Chips plc / Motorola / Intel / /

Country

Iraq / /

Currency

USD / /

Facility

University of Moscow Ph.D. / building Cool Chips™ / /

IndustryTerm

metal configuration / aerospace customers / early production devices / aerospace projects / serious high-value applications / technology / junction technology / thermal management devices / thermoelectric technologies / avionic equipment / watt devices / free-standing devices / active devices / repeatable devices / thermal management / crude metal junction / thermoelectric devices / conventional applications / /

Organization

International Microelectronics and Packaging Society / University of Moscow / /

Person

Rodney T. Cox / Guy Wagner / /

Position

Chairman / applied mathematician / Chairman and CEO / quantum physicist / /

ProgrammingLanguage

DC / /

Technology

junction technology / dielectric / Cool Chip™ technology / /

SocialTag