| Document Date: 2015-05-06 04:31:30
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City LYON / / Company IC / Amkor / Compound Semiconductors / Orbotech Ltd. / SPTS Technologies / TSMC / David Jourdan About SPTS Technologies / Power Electronics / Intel / / Continent North America / Europe / / Country France / United States / United Kingdom / / Currency USD / / Event M&A / / IndustryTerm process solutions / electronic device / electronics reading / corporate finance services / clean metal-to-metal contact / electronics / manufacturing facilities / thermal wafer processing solutions / seen increasing equipment / yield enhancement and production solutions / metal pad / industrial products / micro-electromechanical systems / fan-out technology / equipment supplier / micro manufacturing / bandwidth applications / / NaturalFeature mount RF / / Person David Butler / Yole Développement (Yole) / Yole Développement Founded / Yole Développement / Orbotech / Emile Zola / Yole Développement Le Quartz / / Position Butler / Butler / VP of Product Management and Marketing / VP of Product Management and Marketing / / Region Asia-Pacific / / Technology Baseband processors / Laser / application processors / MEMS / fan-out technology / Two promising Wafer/Panel-Level-Packaging technologies / Optoelectronics / Microfluidics / CVD / Mobile devices / / URL www.yole.fr / www.orbotech.com / www.spts.com / www.i-micronews.com / /
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FOR IMMEDIATE RELEASE FOWLP is now entering a new era …SPTS Technologies, an Orbotech company, interviewed by Yole Développement’s analysts LYON, France –May 6, 2015 – Fan-Out Wafer Level Packaging is now enteri