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Technology / Embedded Wafer Level Ball Grid Array / Three-dimensional integrated circuit / Qimonda / Integrated circuit packaging / Wafer-level packaging / Semiconductor device fabrication / Electronics / Microtechnology


Brokerage H2020 Call ICT2 – 2014 Partner Presentation: NANIUM S.A[removed]Partner and contact person: NANIUM S.A., Vila do Conde, Porto, Portugal Steffen Kröhnert, Director of Technology Expertise and Activities:
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Document Date: 2014-03-10 05:00:00


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File Size: 847,88 KB

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City

Porto / /

Company

NANIUM S.A. / Assembly and Test Manufacturing / FA - Focus / House LABS / Infineon Technologies / Siemens Semiconductors / Leading Edge Embedding Technologies / /

Continent

Europe / /

Country

Portugal / /

Facility

Largest Independent Packaging Foundry / Facility Located / Packaging Foundry / /

IndustryTerm

manufacturing capability / /

Organization

SEMI / General Services Administration / APC Committee / IMAP / Years Assembly / /

Person

Steffen Kröhnert / /

/

Position

Director of Technology Expertise and Activities / /

ProvinceOrState

South Carolina / /

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