Date: 2015-07-18 01:30:08

Electronic engineering

Electromagnetism

Integrated circuits

Electronics

Semiconductor devices

Semiconductor device fabrication

Electronics manufacturing

Survival analysis

Three-dimensional integrated circuit

Through-silicon via

Embedded instrumentation

Built-in self-test

TSV BIST™: An Innovative Method for 2.5D/3D IC Interconnection Integrity Monitoring Hans Manhaeve, Ph.D. Ridgetop Europe, n.v. L. Bauwensstraat 20, B-8200 Brugge, Belgium

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