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Materials science / Three-dimensional integrated circuit / Through-silicon via / Wafer / Chemical-mechanical planarization / Integrated circuit / Microelectromechanical systems / Metrology / Semiconductor device fabrication / Technology / Microtechnology


Document Date: 2014-06-13 12:55:32

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City

Si / ESSCIRC / /

Company

The European Electronic Leaders Group / /

Currency

EUR / /

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IndustryTerm

metal / metrological technology / volume manufacturing / chemical mechanical planarisation / technologies e.g. logic devices / http /

Movie

Transfer / /

Organization

European Union / /

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Position

representative / /

Technology

semiconductor / Keywords 3D technology / FPGA / diverse CMOS technologies / MEMS / optimised multilevel chips / key technologies / TSV technology / integrated circuits / planarisation / CMP / /

URL

http /

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