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Detection and characterization of trace element contamination on silicon wafers Andy Singh, Katharina Baur, Sean Brennan, Takayuki Homma1, Nobuhiro Kubo1, and Piero Pianetta Stanford Synchrotron Radiation Laboratory, 257
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Document Date: 2003-04-14 02:31:06


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File Size: 222,96 KB

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City

Osaka / Tokyo / /

Company

Aqueous Fluoride Solutions / Piero Pianetta Stanford Synchrotron Radiation Laboratory / Stanford Synchrotron Radiation Laboratory / Lawrence Berkeley Labs / Buffered Fluoride Solutions / Thin Solid Films / /

Country

United States / /

Event

Man-Made Disaster / Product Issues / /

Facility

SSRL TXRF facility / TXRF facility / Stanford Synchrotron Radiation Laboratory / Waseda University / /

IndustryTerm

ultra-pure water solutions / lower pH solutions / low pH solutions / copper metal foil spectrum / wet chemical etching / copper metal cluster formation / low energy side / metal deposition / low energy region / excitation energy / chip processing / energy shift / copper metal / high-energy peak / systems involving trace metal deposition / higher pH solutions / ultra pure water solutions / chemical reaction / energy resolution / metal atoms / metal ions / chemical models / trace metal contamination / energy / metal contamination / metal / copper reference metal spectrum / energy position / chemical state / trace copper metal deposition / acidic solutions / chemical shifts / high-energy region / ultra pure water solution / copper metal foil reference / metal oxide/hydroxide / copper interconnect technology / chemical information / trace metal deposition phenomena / /

Organization

Department of Energy / Waseda University / office of Basic Energy Sciences / Stanford / /

Person

Sean Brennan / Ray Near / Katharina Baur / Andy Singh / /

Position

representative / /

Product

UPW / solution / wafer / ultra pure water solutions / /

ProvinceOrState

California / /

Technology

semiconductor / radiation / broadband / x-ray / integrated circuits / copper interconnect technology / Spectroscopy / /

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