Back to Results
First PageMeta Content
Electronics / Rapid thermal processing / Annealing / Thermal oxidation / Wafer / Integrated circuit / Light-emitting diode / Semiconductor fabrication plant / Ultra-high-purity steam for oxidation and annealing / Semiconductor device fabrication / Microtechnology / Technology


A303-medea+ (lo1[removed]:45
Add to Reading List

Document Date: 2009-03-25 10:37:05

Open Document

File Size: 85,35 KB

Share Result on Facebook

Company

PROCESS EQUIPMENT Partners / /

Continent

Europe / /

/

/

IndustryTerm

expected technology standard / spike-annealing applications / lamp-heated systems / technology nodes / rapid thermal processing / cool-down systems / energy consumption / manufacturing / chip manufacturing challenges / semiconductor manufacturing technologies advance / gas bearing / helium gas cushion / individual and related equipment / /

Organization

Information Society / MEDEA+ Office / US Federal Reserve / /

/

Position

Project leader / leader / co-operative / /

Product

F-75755 Paris / /

PublishedMedium

the Information Society / /

Technology

semiconductor / radiation / rapid thermal processing / heat transfer / integrated circuit / /

URL

http /

SocialTag