![Electronics / Rapid thermal processing / Annealing / Thermal oxidation / Wafer / Integrated circuit / Light-emitting diode / Semiconductor fabrication plant / Ultra-high-purity steam for oxidation and annealing / Semiconductor device fabrication / Microtechnology / Technology Electronics / Rapid thermal processing / Annealing / Thermal oxidation / Wafer / Integrated circuit / Light-emitting diode / Semiconductor fabrication plant / Ultra-high-purity steam for oxidation and annealing / Semiconductor device fabrication / Microtechnology / Technology](https://www.pdfsearch.io/img/4c2bb9ddf2a3cc4ac2504652261a4aa3.jpg)
| Document Date: 2009-03-25 10:37:05 Open Document File Size: 85,35 KBShare Result on Facebook
Company PROCESS EQUIPMENT Partners / / Continent Europe / / / / IndustryTerm expected technology standard / spike-annealing applications / lamp-heated systems / technology nodes / rapid thermal processing / cool-down systems / energy consumption / manufacturing / chip manufacturing challenges / semiconductor manufacturing technologies advance / gas bearing / helium gas cushion / individual and related equipment / / Organization Information Society / MEDEA+ Office / US Federal Reserve / / / Position Project leader / leader / co-operative / / Product F-75755 Paris / / PublishedMedium the Information Society / / Technology semiconductor / radiation / rapid thermal processing / heat transfer / integrated circuit / / URL http /
SocialTag |