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SILICON INTERPOSER TECHNOLOGIES FOR 3D SENSOR SYSTEMS Contact
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Document Date: 2015-01-16 06:06:47

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Company

AMR / /

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Facility

Fraunhofer Institute / /

IndustryTerm

consumer electronics / se technologies / mario.baum@enas.fraunhofer.de device / integrated carrier / parallel processing / sensor chips / sensor systems / semiconductor technologies / maik.wiemer@enas.fraunhofer.de sensor chips / interposer technology / 1D sensor chips / carrier device / trough hole technology / /

Organization

Fraunhofer Institute for Electronic / /

Person

Maik Wiemer / /

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Technology

sensor chips / maik.wiemer@enas.fraunhofer.de sensor chips / SILICON INTERPOSER TECHNOLOGIES / se technologies / Electronic interposer technology / MEMS / semiconductor technologies / trough hole technology / interposer technology / 1D sensor chips / parallel processing / /

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