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Heat transfer / Passive fire protection / Heat conduction / Water pollution / Heat sink / Thermal management of electronic devices and systems / Nusselt number / Microfluidics / Water cooling / Mechanical engineering / Thermodynamics / Chemical engineering


CMOSAIC RTD 2009 Integrated Water Cooled 3D Electronic Chips: Experiments and Modeling
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Document Date: 2013-05-28 16:20:41

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File Size: 2,67 MB

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