Professor M.Esashi was awarded "the Best Paper Award by the Institute of Electrical Engineers of Japan". Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS - Separation Method of Glass Layer -, IEEJ Tran - Wafer dicing - Document - PDFSEARCH.IO

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	Professor M.Esashi was awarded "the Best Paper Award by the Institute of Electrical Engineers of Japan". Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS - Separation Method of Glass Layer -, IEEJ Tran Add to Reading List Document Date: 2012-12-05 02:33:23 Open Document File Size: 55,59 KB Share Result on Facebook Facility Institute of Electrical Engineers / / IndustryTerm threshold energy / debris-free in-air laser dicing technology / / Organization Institute of Electrical Engineers of Japan / / Person Masayuki Fujita / Shuji Tanaka / Hideyuki Kikuchi / M.Esashi / Noriaki Miyanaga / Yoshiki Nakata / Masayoshi Esashi / Yosuke Tsurumi / / Position Professor / / Technology Laser / MEMS / debris-free in-air laser dicing technology / / SocialTag Optics Electrical engineering Mechanical engineering Microelectromechanical systems Microtechnology Transducers Laser Nd:YAG laser Wafer Semiconductor device fabrication

Professor M.Esashi was awarded "the Best Paper Award by the Institute of Electrical Engineers of Japan". Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS - Separation Method of Glass Layer -, IEEJ TranAdd to Reading List