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Wafer dicing / Laser cutting / Wafer / Laser / Diode-pumped solid-state laser / 100 micrometres / Dicing saw / Beam parameter product / Laser beam profiler / Technology / Semiconductor device fabrication / Optics


ADVANCES IN LASER SINGULATION OF SILICON Paper #770 Leonard Migliore1, Kang-Soo Lee2, Kim Jeong-Moog2, Choi Byung-Kew2 1Coherent, Inc., Santa Clara, CA, USA 2HBL Corporation, Daejeon[removed]Korea
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Document Date: 2007-04-16 19:43:23

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File Size: 223,85 KB

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City

Santa Clara / /

Company

Coherent Inc. / Choi Byung-Kew2 1Coherent Inc. / Microsoft / Self S.A. / Beam Speed No. Net / USA 2HBL Corporation / /

Country

Ireland / /

IndustryTerm

travel speed / manufacturing / high travel speed / telecommunications / laser energy / energy / /

Person

Leonard Migliore / Overlap Fluence / /

Position

Author / Major / representative / controller / Engineer / /

Technology

LASER / lasers / Laser Technology / integrated circuits / dielectric / integrated circuit / /

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