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Physical quantities / Chemical engineering / Thermal conductivity / Thermal conduction / Thermodynamic temperature / Thermal expansion / Wiedemann–Franz law / Solid / Electrical resistivity and conductivity / Chemistry / Physics / Heat transfer


Chapter[removed]Thermal Properties T
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Document Date: 2007-09-20 19:09:01

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City

New York / /

Company

John Wiley & Sons Inc. / Scientific American Inc. / Lear / Copper Gold Iron Nickel Silver Tungsten 1025 Steel / Lockheed Missiles & Space Company Inc. / John Wiley & Sons / /

IndustryTerm

energy-absorptive processes / heat energy / stainless steel / potential energy-versus-interatomic separation / potential energy trough / atomic bonding energy / potential energy curve / average energy / kinetic energy / symmetric potential energy-versus-interatomic distance curve / energy-absorptive mechanisms / thermal energy assimilation / potential energy / gas constant / vibrational thermal energy / energy values / vibrational energy / thermal energy / plain carbon steel / integrated circuit chip / energy / steel / /

OperatingSystem

Fermi / /

Organization

American Society for Metals / /

Person

H. Baker / Polypropylene Polystyrene Polytetrafluoroethylene / /

Position

Managing Editor / design engineer / /

ProvinceOrState

New York / /

PublishedMedium

Scientific American / /

Technology

radiation / integrated circuit chip / heat transfer / thermal insulation / integrated circuit / /

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