| Document Date: 2013-09-04 08:46:13
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City Paris / / Company Gerold Alberga ASML Netherlands B.V. / EUV / AMTC ASML Netherlands B.V. / SAGEM Défense Sécurité SUSS MicroTec Photomask Equipment GmbH & Co.KG / Dynamic Micro Systems Semiconductor Equipment GmbH / Carl Zeiss SMT GmbH / Device Technology / / Continent Europe / / / Facility DIFFER Fraunhofer Institute / / IndustryTerm volume semiconductor manufacturing / technology areas / 32nm semiconductor wafer technology / pre-production tool systems / manufacturing industry / supply chain / lithography technology / communications technology industry / lithography tool technology / 22nm imaging / high volume semiconductor manufacturing / nano-/microelectronic solutions / 32nm pre-production tools / double patterning technologies / 22nm lithographic tool / lithography entry point technology development / source technology / 22nm tool / manufacturing tool / solar energy / technology roadmap / semiconductor equipment / imaging / semiconductor manufacturing industry / elemental analysis equipment / on delivering nano-/microelectronic solutions / / Organization Institute for Integrated Systems and Device Technology / CATRENE Office / / / Position one of the consortium members / collector / Xenocs XTREME technologies GmbH Project leader / / PublishedMedium the EAGLE / / Technology semiconductor / lithography tool technology / laser / Xenocs XTREME technologies / source technology / security Energy efficiency Digital lifestyle Design technology / double patterning technologies / Interuniversitair MicroElectronica Centrum vzw IMS Chips Media Lario Technologies / lithography / lithography technology / relevant enabling technologies / 32nm semiconductor wafer technology / integrated circuit / / URL www.catrene.org / /
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Project result CT301 I Extreme UV lithography entry point technology development [EXEPT] The extreme ultra-violet (EUV)