EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA

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Date: 2016-07-20 11:09:32 Electronic engineering Electromagnetism Electrical engineering Acoustic microscopy Microscopy Electronics manufacturing Flip chip X-rays Void Integrated circuit Solder Printed circuit board		EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 578,15 KB Share Document on Facebook

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