1![NVM-Series Surface Profiling System NVM-Series is automated high speed measurement tool for in-line process monitor for high density, micro-via substrates used in flip-chip package. Automated align $ auto focus functions NVM-Series Surface Profiling System NVM-Series is automated high speed measurement tool for in-line process monitor for high density, micro-via substrates used in flip-chip package. Automated align $ auto focus functions](https://www.pdfsearch.io/img/e681764736ae775650f01fff3cdc4f1c.jpg) | Add to Reading ListSource URL: nanosystemz.comLanguage: English |
---|
2![Application Note | AN105 Flip-Chip Interconnection Integrity Testing Solutions Introduction This application note describes interconnection reliability problems, provides the flip-chip solution overview, and includes tes Application Note | AN105 Flip-Chip Interconnection Integrity Testing Solutions Introduction This application note describes interconnection reliability problems, provides the flip-chip solution overview, and includes tes](https://www.pdfsearch.io/img/d13c1e4824de9dd001b5a04a551aae90.jpg) | Add to Reading ListSource URL: www.ridgetopgroup.com- Date: 2015-08-21 20:05:36
|
---|
3![Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Characterization of Flip Chip Interconnect Failure Modes Using High Frequency Acoustic Micro Imaging With Correlative Analysis Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street](https://www.pdfsearch.io/img/c63387da424ef40398aba323a0fba82e.jpg) | Add to Reading ListSource URL: www.sonoscan.com- Date: 2016-07-20 11:09:32
|
---|
4![CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.](https://www.pdfsearch.io/img/531f7feabc9f586b54c0696a08310375.jpg) | Add to Reading ListSource URL: www.sonoscan.comLanguage: English - Date: 2016-07-20 11:09:32
|
---|
5![Microsoft Word - MXP7205VF Rev.E.doc Microsoft Word - MXP7205VF Rev.E.doc](https://www.pdfsearch.io/img/8ed36815c36f80f1e50e7b02e51673f0.jpg) | Add to Reading ListSource URL: www.memsic.comLanguage: English - Date: 2013-02-11 20:35:20
|
---|
6![6 Position Flip Chip - Ford Pacific Performance Engineering, Inc. www.ppediesel.com 6 Position Flip Chip Ford 6 Position Flip Chip - Ford Pacific Performance Engineering, Inc. www.ppediesel.com 6 Position Flip Chip Ford](https://www.pdfsearch.io/img/aed1777dfbba64a3cb8da20fdd6b449b.jpg) | Add to Reading ListSource URL: www.pacificp.comLanguage: English - Date: 2012-12-21 18:46:04
|
---|
7![EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA EVALUATION OF UNDERFILL IN FLIP CHIP AND BGA ON PC BOARDS USING 3V RECONSTRUCTION AND THROUGHTRANSMISSION IMAGING Janet E. Semmens Sonoscan, IncE. Pratt Boulevard Elk Grove Village, ILUSA](https://www.pdfsearch.io/img/bd3d2fc435dceaa3a7f68a82b3c2ee4e.jpg) | Add to Reading ListSource URL: www.sonoscan.comLanguage: English - Date: 2016-07-20 11:09:32
|
---|
8![MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m MICROELECTRONICS ASSEMBLY Microelectronics Assembly With over four decades of experience in high reliability hybrid and RF technologies, NEO Tech has emerged as North America’s largest microelectronics assembler. The m](https://www.pdfsearch.io/img/e3f22cec33d44c58aa746fa72cdcef05.jpg) | Add to Reading ListSource URL: www.neotech.comLanguage: English - Date: 2016-01-20 13:47:56
|
---|
9![「維基夥伴獎學金」獎助生成果報告書 簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser:Prof. Edward Yi Chang 「維基夥伴獎學金」獎助生成果報告書 簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications Adviser:Prof. Edward Yi Chang](https://www.pdfsearch.io/img/cb6c1bac167b820d677132061dd7dac4.jpg) | Add to Reading ListSource URL: diamondprj.nctu.edu.twLanguage: English - Date: 2015-08-26 02:29:40
|
---|
10![Microsoft Word - MXP7205VW Rev.Cdoc Microsoft Word - MXP7205VW Rev.Cdoc](https://www.pdfsearch.io/img/01bc66ded90041c95ddd7ee87bc32811.jpg) | Add to Reading ListSource URL: www.memsic.comLanguage: English - Date: 2013-03-14 17:42:45
|
---|