CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.

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Date: 2016-07-20 11:09:32 Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope		CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A. Add to Reading List Source URL: www.sonoscan.com Download Document from Source Website File Size: 1,03 MB Share Document on Facebook

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