Back to Results
First PageMeta Content
Chemistry / Technology / Coatings / Microtechnology / Sputtering / Evaporation / Thin film / Lift-off / Resist / Semiconductor device fabrication / Thin film deposition / Materials science


Introduction of Complete Sputtering Metallization in Conjunction with CO2 Snow Lift-Off for High Volume GaAs Manufacturing Fabian Radulescu, Paul Miller, Liam Cunnane*, Mark Harris*, Hien Lam* and Charles Bowers**
Add to Reading List

Document Date: 2010-08-11 21:15:32


Open Document

File Size: 60,74 KB

Share Result on Facebook

City

Livermore / Newport / Hillsboro / /

Company

GaAsMANTECH Inc. / Trikon Technologies / Sputtered Metal / TriQuint Semiconductor / /

/

Facility

Oregon Graduate Institute / /

IndustryTerm

metal deposition method / metal / metal layer / high manufacturing yields / reduced sidewall metal coverage / unwanted metal / batch-style processing / loosened metal / evaporated metal films / in-situ processing steps / snow metal lift-off / evaporated metal / prevalent batch processing technique / metal deposition / metal line / wafer processing / cassette-to-cassette processing / metal films / large consumer electronics / large dome systems / manufacturing line / volume applications / higher kinetic energy flux / cassette-to-cassette cluster metallization tools / /

Organization

Oregon Graduate Institute / /

Person

David Butler / Andy Bavin / Rick Morton / Jerry Mahoney / Paul Miller / Fabian Radulescu / Jack McCarthy / Jeremy Middleton / Jinhong Yang / Liam Cunnane / Mark Harris / Charles Bowers / /

/

ProvinceOrState

Oregon / /

Technology

semiconductor / Av / Integrated Circuit / /

SocialTag