Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T

First Page		Document Content
Date: 2014-09-30 21:12:39 Electronic engineering Probe card Flip chip Microelectromechanical systems Reliability Solder Wafer testing Bead probe technology Millipede memory Semiconductor device fabrication Technology Materials science		Reliable testing of Cu pillar technology for smart devices By Amer Cassier, Lily Zhao, Ahmer Syed, Steve Bezuk, William Miller [Qualcomm] and Amy Leong, Mike Slessor [FormFactor Inc.] T Add to Reading List Source URL: www.formfactor.com Download Document from Source Website File Size: 1,29 MB Share Document on Facebook

	4th International Seminar and Workshop Emerging Technology and Innovation for Cultural Heritage INVITED LECTURESNovember 2016 “Dimitrie Gusti” National Museum of Village DocID: 1xW1L - View Document
	1 <> DocID: 1xVYV - View Document
	Technology - investing in creative destruction New technologies enable us to do things cheaper, better and faster – creating new markets, but in the process often destroying old ones. This process continues to accelera DocID: 1xVYL - View Document
	Platform technology Manage business growth and complexity with a highly scalable, efficient and flexible platform. Platform DocID: 1xVY8 - View Document
	Specification of Parametric Monitors Quantified Event Automata versus Rule Systems Klaus Havelund1? and Giles Reger2 1 Jet Propulsion Laboratory, California Inst. of Technology, USA DocID: 1xVWh - View Document