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Knowledge / Management / Science / Dietary minerals / Knowledge spillover / Semiconductor device fabrication / Copper / Absorptive capacity / Organizational theory / Research and development


Industrial and Corporate Change, Volume 18, Number 6, pp. 1249–1284 doi:[removed]icc/dtp044 Advance Access published November 4, 2009 The many faces of absorptive capacity: spillovers of copper interconnect
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Document Date: 2012-07-31 00:43:18


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Company

IBM / VLSI / UMC / AT&T / NEC / Exploratory (with a focus on autonomy) Linking / Lucent / TSMC / Motorola / Hitachi / Mid 1999 30 10 TSMC- Taiwan Semiconductors / Oxford University Press / Levinthal / Texas Instruments / AMD / Cohen / Intel / /

Country

United States / /

Currency

AMD / USD / /

IndustryTerm

copper technology / https /

MarketIndex

Science Citation / /

Organization

US Patent Office / Semiconductor Industry Association / SEMI / Oxford University / International Criminal Court / /

Person

Zahra / George / Van Den Bosch / /

Position

specific Encoded General scientific knowledge Solutions / general scientific knowledge / first author / Author / /

Product

Motorola 40 3 / /

Technology

semiconductor / particular technology / semiconductor chip / important semiconductor technology / copper interconnect technology / chemical vapor deposition / CMP / 1254 K. Lim technology / semiconductors / copper interconnect technologies / CVD / 1999 2 VLSI Technology / /

URL

www.sia-online.org/downloads/shares.pdf / http /

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