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3![COPPER METALLIZATION OF SEMICONDUCTOR INTERCONNECTS – -- ISSUES AND PROSPECTS Uziel Landau Chemical Engineering Department and The Yeager Center for Electrochemical Sciences COPPER METALLIZATION OF SEMICONDUCTOR INTERCONNECTS – -- ISSUES AND PROSPECTS Uziel Landau Chemical Engineering Department and The Yeager Center for Electrochemical Sciences](https://www.pdfsearch.io/img/d90e71a2751176c05b461dc30775f318.jpg) | Add to Reading ListSource URL: www.l-chem.comLanguage: English - Date: 2004-04-07 12:01:23
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4![Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch Formation of Highly Reliable Cu/Low-k Interconnects by Using CVD Co Barrier in Dual Damascene Structures Hye Kyung Jung, Hyun-Bae Lee, Matsuda Tsukasa, Eunji Jung, Jong-Ho Yun, Jong Myeong Lee, Gil-Heyun Choi, Siyoung Ch](https://www.pdfsearch.io/img/9356669c1fff1902c9bb89f11e5a1bd2.jpg) | Add to Reading ListSource URL: www.appliedmaterials.comLanguage: English - Date: 2014-05-12 14:31:02
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5![NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT](https://www.pdfsearch.io/img/68da87536c048df9075e0fb5301d9677.jpg) | Add to Reading ListSource URL: www.appliedmaterials.comLanguage: English - Date: 2014-01-26 17:00:01
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6![Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation Robust TSV ViaMiddle and ViaReveal Process Integration Accomplished through Characterization and Management of Sources of Variation](https://www.pdfsearch.io/img/1e1910a0310a92b276b22fd9ee2f6b9b.jpg) | Add to Reading ListSource URL: www.appliedmaterials.comLanguage: English - Date: 2014-05-27 18:47:55
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7![Microtechnology / Chemical-mechanical planarization / Etching / Polishing / Semiconductor / Solid / Copper interconnect / Semiconductor device fabrication / Materials science / Technology Microtechnology / Chemical-mechanical planarization / Etching / Polishing / Semiconductor / Solid / Copper interconnect / Semiconductor device fabrication / Materials science / Technology](/pdf-icon.png) | Add to Reading ListSource URL: www.erc.arizona.eduLanguage: English - Date: 1999-12-02 13:42:10
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8![Industrial and Corporate Change, Volume 18, Number 6, pp. 1249–1284 doi:[removed]icc/dtp044 Advance Access published November 4, 2009 The many faces of absorptive capacity: spillovers of copper interconnect Industrial and Corporate Change, Volume 18, Number 6, pp. 1249–1284 doi:[removed]icc/dtp044 Advance Access published November 4, 2009 The many faces of absorptive capacity: spillovers of copper interconnect](https://www.pdfsearch.io/img/c6b0478998f627f9ae34d441e1d08f85.jpg) | Add to Reading ListSource URL: kwanghui-public.s3.amazonaws.comLanguage: English - Date: 2012-07-31 00:43:18
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9![SIMTech Technical Report (PT[removed]JT) Chemical Mechanical Planarization SIMTech Technical Report (PT[removed]JT) Chemical Mechanical Planarization](https://www.pdfsearch.io/img/a648b808c72d4a9447fda27bb753ce1b.jpg) | Add to Reading ListSource URL: maltiel-consulting.comLanguage: English - Date: 2013-04-20 18:07:00
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