Low-k dielectric

Results: 19



#Item
186 Technology focus: GaN HEMTs  First application of low-cost deposition of titanium dioxide for GaN MOS-HEMT Ultrasonic spray pyrolysis deposition has been used to create devices

86 Technology focus: GaN HEMTs First application of low-cost deposition of titanium dioxide for GaN MOS-HEMT Ultrasonic spray pyrolysis deposition has been used to create devices

Add to Reading List

Source URL: www.semiconductor-today.com

Language: English - Date: 2015-01-23 09:10:57
2AMDp2 - 5  High-Performance and Low-Temperature-Compatible Solid Phase Crystallized Polycrystalline Silicon Thin Film Transistors Using Thermal Oxide Buffered Aluminum Oxide as Gate Dielectric

AMDp2 - 5 High-Performance and Low-Temperature-Compatible Solid Phase Crystallized Polycrystalline Silicon Thin Film Transistors Using Thermal Oxide Buffered Aluminum Oxide as Gate Dielectric

Add to Reading List

Source URL: www.pskl.ust.hk

Language: English - Date: 2014-10-10 03:11:48
32001 IEEE 7th International Conference on Solid Dielectrics, June 25-29,2001, Eindhoven, the Netherlands 187  NOVEL THIN FILM POLYMER FOAMING TECHNIQUE FOR LOW AND ULTRA LOW-K DIELECTRICS B. Krause, G.H. Koops, N.F.A. va

2001 IEEE 7th International Conference on Solid Dielectrics, June 25-29,2001, Eindhoven, the Netherlands 187 NOVEL THIN FILM POLYMER FOAMING TECHNIQUE FOR LOW AND ULTRA LOW-K DIELECTRICS B. Krause, G.H. Koops, N.F.A. va

Add to Reading List

Source URL: doc.utwente.nl

Language: English - Date: 2011-08-28 10:53:45
4nfos  CALL FOR PAPERS 19th Conference on “Insulating Films on Semiconductors” 29 June-2 July 2015, Udine, Italy

nfos CALL FOR PAPERS 19th Conference on “Insulating Films on Semiconductors” 29 June-2 July 2015, Udine, Italy

Add to Reading List

Source URL: infos2015.uniud.it

Language: English - Date: 2014-12-18 11:11:53
5INFOS2015_1st_Announcement_2.1

INFOS2015_1st_Announcement_2.1

Add to Reading List

Source URL: infos2015.uniud.it

Language: English - Date: 2014-12-18 11:11:53
6NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

NANOCHIP Technology Journal EXTENDING COPPER INTERCONNECT

Add to Reading List

Source URL: www.appliedmaterials.com

Language: English - Date: 2014-01-26 17:00:01
7728  IEEE ELECTRON DEVICE LETTERS, VOL. 31, NO. 7, JULY 2010 Characterization of Selectively Deposited Cobalt Capping Layers: Selectivity and

728 IEEE ELECTRON DEVICE LETTERS, VOL. 31, NO. 7, JULY 2010 Characterization of Selectively Deposited Cobalt Capping Layers: Selectivity and

Add to Reading List

Source URL: www.appliedmaterials.com

Language: English - Date: 2014-05-12 14:27:49
82998  Macromolecules 2006, 39, [removed]SANS and XRR Porosimetry of a Polyphenylene Low-k Dielectric Michael S. Silverstein*

2998 Macromolecules 2006, 39, [removed]SANS and XRR Porosimetry of a Polyphenylene Low-k Dielectric Michael S. Silverstein*

Add to Reading List

Source URL: www.ncnr.nist.gov

Language: English - Date: 2006-04-13 10:24:47
9six0512low.qxd[removed]:50 PM

six0512low.qxd[removed]:50 PM

Add to Reading List

Source URL: www.sgw.com

Language: English - Date: 2012-02-08 11:03:30
10INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION

INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION

Add to Reading List

Source URL: public.itrs.net

Language: English - Date: 2014-03-27 14:06:28