| Document Date: 2014-03-27 14:06:28
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IndustryTerm metal / interconnect/packaging architecture design optimization tool / mainstream potential solution / pre-metal dielectric / technology generations / architecture solutions / projected overall technology requirements / copper processing / energy efficiency / copper-containing chips / metallization potential solution / high throughput imaging metrology / interconnect solutions / metal structures / manufacturable solutions / possible solution / interconnect technology generations / materials solutions / meet manufacturing targets / / Position General / technology driver for the most advanced M1 pitch / conductor / technology driver / single technical product driver / / Technology radio frequency / Three-dimensional chip / flash memory / process control / Flash / copper-containing chips / dielectric / CMP / integrated circuit / /
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INTERNATIONAL TECHNOLOGY ROADMAP FOR SEMICONDUCTORS[removed]EDITION