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Technology / Chemical-mechanical planarization / Copper interconnect / Microelectromechanical systems / Etching / Surface finishing / Surface micromachining / Shallow trench isolation / Photolithography / Semiconductor device fabrication / Materials science / Microtechnology


SIMTech Technical Report (PT[removed]JT) Chemical Mechanical Planarization
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Document Date: 2013-04-20 18:07:00

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File Size: 2,08 MB

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Company

John Wiley & Sons Inc. / /

Facility

Institute of Microelectronics / /

IndustryTerm

process technologies / metal / chemical etching / electronics / chemical reactions / metal line / manufacturing / metal interconnection / chemical and mechanical effects / process technology / metal deposition / chemical and mechanical forces / /

MusicGroup

Device / Process / /

Organization

Process Technology Division / Institute of Microelectronics / MIT / /

Person

Shyam P. Murarka / Taber Hardesty Smith / Joseph M. Steigerwald / Wang Zhengfeng / Ronald J. Gurmann / /

Technology

semiconductor / Chemical Mechanical Polishing / laser / process technologies / MEMS / enabling technology / Chip Design / 3-D / process technology / Process Control / photolithography / CMP technology / dielectric / CMP / /

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