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| First Page | Document Content | |
|---|---|---|
 Date: 2016-07-20 11:09:32Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope |
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| First Page | Document Content | |
|---|---|---|
Date: 2016-07-20 11:09:32Microscopy Electronics manufacturing Manufacturing Economy Business Acoustic microscopy Flip chip Solder Reliability Integrated circuit Bump Microscope |
Add to Reading List |
CHARACTERIZATION OF FLIP CHIP BUMP FAILURE MODES USING HIGH FREQUENCY ACOUSTIC MICRO IMAGING Janet E. Semmens and Lawrence W. Kessler SONOSCAN, INC. 530 East Green Street Bensenville, ILU.S.A.
